ISO 9001:2015 Certified
SLTL Group is the eminent manufacturer & supplier of the 4p diamond laser machine. Hallmark 4G is a perfect blend of an advanced innovation with the best practices and must for all the Diamond Manufacturers around the World. Hallmark 4G is an all in one Diamond Processing System doing Table Sawing, Crowning, Bruiting, and Cone Blocking with one time fixing of the stone. Hallmark 4G is the 4th generation laser processing machine with inbuilt software for laser beam stability & robotic CNC control features. These are the new generation robots for diamond processing which will help redefine laser operations in the diamond industry, with the potential to produce almost 80% of the Work. This provides you with more systematic production cycle with error-free operations.
Multiple diamond processing system doing Table sawing, Crowning, Bruiting & cone blocking, with high accuracy and speed at a marginal time without any human intervention with one time fixing of the stone. Hallmark 4G can also be integrated with our planer machine so that even the planning process gets into system with minimal human interference. Along with saving a lot of time, it also increases the efficiency & diminishes losses due to human errors. This provides you with more systematic production cycle with error free operations.
Machine is manufactured under the guidance of experts which increase the durability of Machine and helps to reduce the maintenance costs. High grade optics and advanced technology clubbed in a single, compact and scratch proof body.
The Gain is all yours while processing the stone SLTL provides you with almost nil breakage rate due to RTLS (Real Time Laser System). Extremely focused, stable and accurate beam profile to achieve weight loss which provides you with fewer operation errors. SLTL delivers advance processing system which gives you a better quality output and satisfying result
The most Progressive & easy to understand software is very straight forward. It is being designed to decreases the man-machine intervention significantly which eventually results in minimum possible human errors. software packagenot only helps in reducing the risk of damaging the stone but also automatically sets optimized laser parameters based on the size of a diamond.
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Laser Source |
SPAQ 75 W CW |
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Laser Type |
DPSSL |
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Wave Length |
1064 mm |
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Beam Mode |
TEM00 |
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Working Power |
4 - 18 Watt |
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CNC Table |
170 × 170 mm |
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Resolution |
1 Micron |
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Repeatability |
3 Micron |
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Accuracy |
2 Micron |
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Drive Type |
AC SERVO |
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Z Axis Travel |
50 mm |
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Power Supply |
1 Phase, 15 Amp |
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Power Consumption |
1.7 KW |
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Operating Environment |
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Temperature / Humidity |
20 - 30 °C / <60% |
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Coolant Requirement |
4 - 6 Ltr/Hr |
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Dimension |
1725 × 990 × 1610 mm |
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Computer System: Intel Dual Core |
1 GB, 160 GB HHD, 17" LCD |
A unique cutting method that smoothen a top surface of the rough stone with high accuracy and minimum wastage of diamond
Shaping the perfect surface between table and girdle to get the perfect crown with optimum weight loss, lower breakage.
It gives the perfect shape & removes the unwanted surface which involves the shaping of the circumference of a diamond separating the crown and pavilion.
The ultimate shaping of diamond making completes the cone shaped lower part of the diamond with negligible weight loss, optimum breakage and minimum maintenance costs.
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