Contact Us

Patented Laser Technology

IoT, AI, ANN, Industry 4.0

ISO & CE Certified

Industry First Solutions

Wafer Dicing System

Wafer Dicing System

Semiconductor wafer processing system

Get a Quote
Wafer Dicing System Front View

Wafer Dicing System Front View

Wafer Dicing System Left View

Wafer Dicing System Left View

Wafer Dicing System Back View

Wafer Dicing System Back View

Wafer Dicing System Right View

Wafer Dicing System Right View

Wafer Dicing System Top View

Wafer Dicing System Top View

Wafer Dicing System front left View

Wafer Dicing System front left View

Reasons you'll love Wafer Dicing System

High Precision
High Precision
Compact Rugged Laser
Compact Rugged Laser
Water Cooling
Water Cooling
Camera Vision System
Camera Vision System
User Specific Application Software
User Specific Application Software

We Build Memorable Digital Experiences.

Ever since our incorporation, we have been making our own way through the domains and industries.

Wafer Dicing System
Download Brochure Enquire Now
  • Overview
  • Technical Specification

Product Description

Semiconductor wafer processing system

Specification

Wave Length 532 nm
Working Power 8 – 15 Watt
CNC Table 180 × 180 mm
Beam Spot ≤20-25 µm (depend on optics config.)
Accuracy ±2 µm
Power Supply 230 VAC+/- 10%, Single Phase
Dimension 1400 × 975 × 1700 mm (approx.)
Computer System Intel® Core™ i3 based CPU or higher
Warm-up Time < 5 minutes
Cooling Method Water-cooled
Power Stability ±5%
Polarization Linear
Controller Interface RS232/USB/Ethernet

*Product specification and data are subject to change or vary without notice to improve reliability function or design.

Support & Services

24*7

Support

Calls <8 Min

Online Service Response 100%

97.5% <6 Hrs

Physical Response

98.7%

Delighted Customers

Interested In a Product?

GET A QUOTE

Pricing, Technical Data & More

    Blogs

    Explore our blogs for a resourceful insight into the infinite opportunities of the laser world.

    Top Secret to Burr Free Laser-Cutting

    You might have witnessed in your regular day at shop floor that the metal sheets of cut parts are offloaded by an operator.

    Laser Cutting Machine, Marking and Welding System – SLTL Group

    SLTL Group is the company that has defined what is called a "Trailblazer".

    How Advanced Laser Solutions Are Helping Industries Stay Competitive

    Have you ever pondered about the laser technology that everybody seems to be talking about? Actually, you would be surprised to know that Laser is just an acronym for Light Amplification by Stimulated Emission of Radiation.

    CONNECT WITH US


      Happy to Help

      24*7 service support and technical assistance. You’re welcome to visit our office for other insights

      mkt@SLTL.com +91-9925036495

      Address:

      E-30, Electronic Estate, G. I. D. C.,
      Sector - 26, Gandhinagar - 382 028
      Gujarat, India.